TH-50/ TH-80
LIB Industry
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The LIB benchtop temperature cycling chamber for Environmental Stress Screening ESS is available in compact configurations of 50L and 80L, making it an ideal solution for laboratories with limited space while maintaining high-performance environmental simulation capability. It is widely used for reliability testing of PCBs, semiconductor components, sensors, medical electronics, communication modules, and various small laboratory specimens. The equipment can be conveniently placed on a laboratory bench or positioned under a workstation, significantly improving space utilization in R&D environments. A 7-inch intelligent touchscreen controller is integrated into the system, supporting up to 120 programmable test profiles, each containing up to 100 steps. This allows fully automated execution of complex thermal cycling sequences. Ethernet connectivity and real-time data logging enable seamless integration with laboratory information systems and quality traceability platforms.
Working Principle of the Benchtop Temperature Cycling Chamber
1. Quiet Refrigeration and Uniform Air Circulation System: The system adopts a compressor-based refrigeration unit combined with a centrifugal airflow circulation design to ensure stable and uniform environmental conditions inside the chamber. Optimized air ducts and baffle structures distribute conditioned air evenly throughout the workspace, minimizing temperature gradients and ensuring consistent exposure across all test samples. The noise level is controlled at or below 65 dBA, allowing the chamber to operate continuously in laboratories, offices, and shared R&D environments without disturbance.
2. Rapid Thermal Cycling Control System: The chamber integrates high-efficiency refrigeration components and electric heating elements to achieve fast temperature transitions required for Environmental Stress Screening (ESS). An intelligent PID control system continuously adjusts heating and cooling output based on real-time sensor feedback. The system supports heating rates of up to 3°C/min and cooling rates of approximately 1°C/min, reducing cycle time and improving testing efficiency while accelerating defect detection in electronic products.
3. High-Precision Temperature and Humidity Control: Equipped with PT100 Class A sensors featuring 0.001°C resolution, the system continuously monitors internal environmental conditions. The PID-based control algorithm dynamically regulates heating, cooling, and humidification functions, maintaining temperature stability within ±0.5°C and humidity accuracy within ±2% RH. This ensures highly reliable and repeatable test results for sensitive electronic and semiconductor applications.
4. Intelligent Humidification and Moisture Simulation System: A closed-loop humidification system automatically supplies and recycles water during testing, enabling accurate simulation of high-humidity, condensation, and damp heat conditions. This system effectively reproduces environmental conditions such as tropical climates, coastal humidity, and moisture exposure scenarios. By recycling condensate water, it reduces water consumption and improves operational sustainability during long-duration testing cycles.
5. Programmable Automated Testing System: The chamber is equipped with a 7-inch touchscreen controller capable of storing up to 120 test programs, each supporting up to 100 programmable steps. Users can design complex ESS profiles combining temperature cycling, humidity exposure, dwell times, and transition sequences. The system supports Ethernet communication and real-time data logging, enabling unattended long-term operation while ensuring full traceability and data integrity.
6. Safety and Structural Protection Design: The inner chamber is constructed from corrosion-resistant SUS304 stainless steel, ensuring durability under continuous high-temperature and high-humidity operation. The outer housing is made of reinforced A3 steel panels for long-term mechanical stability. Multiple safety protection systems are integrated, including over-temperature protection, leakage current protection, compressor overload protection, grounding protection, and phase sequence monitoring, ensuring safe operation for both equipment and test samples.
Technical Specifications of the Benchtop Temperature Cycling Chamber
Model | TH-50 | TH-80 |
Internal Dimension (mm) | 320*350*450 | 400*400*500 |
Overall Dimension (mm) | 820*1160*950 | 900*1210*1000 |
Interior Volume | 50L | 80L |
Temperature Range | A : -20℃ ~ +150 ℃ B : -40℃ ~ +150 ℃ C: -70℃ ~ +150 ℃ | |
Temperature Fluctuation | ± 0.5 ℃ | |
Temperature Deviation | ± 2.0 ℃ | |
Humidity Range | 20% ~ 98% RH | |
Humidity Deviation | ± 2.5% RH | |
Cooling Rate | 1 ℃ / min | |
Heating Rate | 3 ℃ / min | |
Cooling system | Mechanical compression refrigeration system | |
Controller | Programmable color LCD touch screen controller, Ethernet connection, PC Link | |
Safety Device | Humidifier Dry-combustion protection; Over-temperature Protection; Over-current Protection; Refrigerant High-pressure protection; Water Shortage Protection; Earth leakage Protection | |
Exterior Material | A3 Steel Plate with protective coating | |
Interior Material | SUS304 Stainless Steel | |
Compliance with International Environmental Testing Standards
LIB Benchtop ESS chambers comply with a broad range of international environmental testing standards, including IEC 60068-2-1 and IEC 60068-2-2 for low- and high-temperature testing, IEC 60068-2-14 for thermal cycling, IEC 60068-2-30 and IEC 60068-2-78 for damp heat testing, JESD22-A104 for semiconductor thermal cycling, JESD22-A101 for steady-state humidity reliability testing, ISO 16750 for automotive electronics environmental validation, ASTM D4332 for conditioning procedures, UN38.3 for lithium battery transport simulation, and other environmental test standards. Typical conditions include thermal cycling between –40 °C and +85 °C for PCB reliability testing, humidity exposure at 85 °C/85 % RH for electronic component durability, low-temperature storage at –55 °C for aerospace modules, and high-temperature aging at +125 °C for automotive electronic systems.
Video of the Benchtop Temperature Cycling Chamber
Maintenance Guide of the Benchtop Temperature Cycling Chamber
The Temperature and Humidity Test Chamber Maintenance Processing List covers routine inspection and maintenance of key systems, including heating, humidification, cooling, electrical, and structural components. It requires regular checking of heating elements, fans, sensors, and control devices to ensure stable temperature performance, as well as cleaning and maintenance of condensers, compressors, evaporators, humidifiers, water tanks, and pipelines to maintain efficient cooling and humidity control. Electrical parts such as controllers, relays, and circuit boards should be kept clean and securely connected for reliable operation. Sealing components, locks, and rubber plugs also need periodic inspection to prevent leakage and aging. Overall, proper maintenance ensures stable performance, accurate testing conditions, and long-term reliability of the euipment.